JPS6426851U - - Google Patents
Info
- Publication number
- JPS6426851U JPS6426851U JP12193587U JP12193587U JPS6426851U JP S6426851 U JPS6426851 U JP S6426851U JP 12193587 U JP12193587 U JP 12193587U JP 12193587 U JP12193587 U JP 12193587U JP S6426851 U JPS6426851 U JP S6426851U
- Authority
- JP
- Japan
- Prior art keywords
- area
- die pad
- semiconductor device
- plated
- partially
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12193587U JPS6426851U (en]) | 1987-08-07 | 1987-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12193587U JPS6426851U (en]) | 1987-08-07 | 1987-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6426851U true JPS6426851U (en]) | 1989-02-15 |
Family
ID=31369399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12193587U Pending JPS6426851U (en]) | 1987-08-07 | 1987-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6426851U (en]) |
-
1987
- 1987-08-07 JP JP12193587U patent/JPS6426851U/ja active Pending